Theses most similar to those of author Fan, We
Advanced modeling of planarization processes for integrated circuit fabrication (2012) read it
- Advisor: S. Mark Spearing
- Department of Mechanical Engineering
Mechanics, mechanisms, and modeling of the chemical mechanical polishing process
Lai, Jiun-Yu (2001)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing
Noh, Kyungyoon (2005)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Face-up chemical mechanical polishing : kinematics and material removal rate
Jammalamadaka, Arvind K. (Arvind Kumar), 1981- (2006)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Modeling of pattern dependencies in the fabrication of multilevel copper metallization
Cai, Hon (2007)
- Advisors: Carl V. Thompson, II; Donald S. Boning Duane S. Boning
- Department of Materials Science and Engineering
Physical understanding and modeling of chemical mechanical planarization in dielectric materials
Xie, Xiaoli (2007)
- Advisors: David Litster; Duane Boning
- Department of Physics
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Scratching by pad asperities in chemical mechanical polishing
Roberts, Michael P. (Michael Philip) (2011)
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering