Theses most similar to those of author Noh, Kyungyoon
Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing (2005) read it
Mechanics, mechanisms, and modeling of the chemical mechanical polishing process
Lai, Jiun-Yu (2001)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Modeling of chemical mechanical polishing using fixed abrasive technology
Dutt, Radhika, 1978- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Face-up chemical mechanical polishing : kinematics and material removal rate
Jammalamadaka, Arvind K. (Arvind Kumar), 1981- (2006)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Nagarajan, Raghavan (2008)
- Advisors: Carl V. Thompson, II; Chee Lip Gan
- Department of Materials Science and Engineering
Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries
Johnson, Joy Marie (2009)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Modeling of chemical mechanical polishing for shallow trench isolation
Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science