Theses most similar to those of author Johnson, Joy Marie
Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries (2009) read it
Modeling of chemical mechanical polishing using fixed abrasive technology
Dutt, Radhika, 1978- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing
Noh, Kyungyoon (2005)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Effects of mechanical properties on the reliability of Cu/low-k metallization systems
Wei, Frank L. (Frank Lili), 1977- (2007)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Using statistical metrology to understand pattern-dependent ILD thickness variation in oxide CMP processes
Divecha, Rajesh Ramji (1997)
- Advisor: Duane Boning
- Department of Electrical Engineering and Computer Science
Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Nagarajan, Raghavan (2008)
- Advisors: Carl V. Thompson, II; Chee Lip Gan
- Department of Materials Science and Engineering
Physical understanding and modeling of chemical mechanical planarization in dielectric materials
Xie, Xiaoli (2007)
- Advisors: David Litster; Duane Boning
- Department of Physics
A test structure for the measurement and characterization of layout-induced transistor variation
Chang, Albert Hsu Ting (2009)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing for shallow trench isolation
Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Slurry abrasive particle agglomeration experimentation and modeling for chemical mechanical planarization (CMP) (2015) read it
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Face-up chemical mechanical polishing : kinematics and material removal rate
Jammalamadaka, Arvind K. (Arvind Kumar), 1981- (2006)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
Physical understanding and modeling of chemical mechanical planarization in dielectric materials
Xie, Xiaoli (2007)
- Advisors: David Litster; Duane Boning
- Department of Physics