Theses most similar to those of author Nagarajan, Raghavan
Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits (2008) read it
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Engineered substrates for coplanar integration of lattice-mismatched semiconductors with silicon
Pitera, Arthur Joseph, 1975- (2005)
- Advisor: Eugene A. Fitzgerald
- Department of Materials Science and Engineering
Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing
Noh, Kyungyoon (2005)
- Advisors: Dr. Jung-Hoon Chun; Nannaji Saka
- Department of Mechanical Engineering
The effects of strain on carrier transport in thin and ultra-thin SOI MOSFETs
Lauer, Isaac, 1976- (2005)
- Advisor: Dimitri A. Antoniadis
- Department of Electrical Engineering and Computer Science
- Advisors: Anantha P. Chandrakasan; L. Rafael Reif
- Department of Electrical Engineering and Computer Science
Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits
Tadepalli, Rajappa, 1979- (2007)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Effects of mechanical properties on the reliability of Cu/low-k metallization systems
Wei, Frank L. (Frank Lili), 1977- (2007)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries
Johnson, Joy Marie (2009)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Dimitri A. Antoniadis
- Department of Electrical Engineering and Computer Science
- Advisor: L. Rafael Reif
- Department of Electrical Engineering and Computer Science