Theses most similar to Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries (Johnson, Joy Marie; 2009) read it
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Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
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- Department of Electrical Engineering and Computer Science
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Effects of mechanical properties on the reliability of Cu/low-k metallization systems
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- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Using statistical metrology to understand pattern-dependent ILD thickness variation in oxide CMP processes
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- Department of Electrical Engineering and Computer Science
Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Nagarajan, Raghavan (2008)
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Physical understanding and modeling of chemical mechanical planarization in dielectric materials
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A test structure for the measurement and characterization of layout-induced transistor variation
Chang, Albert Hsu Ting (2009)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing for shallow trench isolation
Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science