Theses most similar to those of author Park, Tae Hong, 1973-
Characterization and modeling of pattern dependencies in copper interconnects for integrated circuits (2002) read it
Characterization and modeling of polysilicon MEMS chemical-mechanical polishing
Tang, Brian D. (Brian David), 1980- (2004)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Characterization and modeling of plasma etch pattern dependencies in integrated circuits
Abrokwah, Kwaku O (2006)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Framework for characterization of copper interconnect in damascene CMP processes
Park, Tae Hong, 1973- (1998)
- Advisors: Duane Boning; James Chung
- Department of Electrical Engineering and Computer Science
Polycrystalline Si thin films and devices : I. Seed selection through ion channeling II. Thin-film transistors
Kung, Kenneth Ting-Yuan (1988)
- Advisor: L. Rafael Reif
- Department of Electrical Engineering and Computer Science
Characterization and modeling of uniformity in chemical mechanical polishing
Oji, Charles (Charles Ojih), 1974- (1999)
- Advisors: Duane Boning; James Chung
- Department of Electrical Engineering and Computer Science
Liquid embossing : a technique for fabricating sub-micron electrical, mechanical and biological structures
Bulthaup, Colin A. (Colin Aaron), 1976- (2001)
- Advisor: Joseph M. Jacobson
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing for shallow trench isolation
Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Framework for characterization of copper interconnect in damascene CMP processes (1998) read it
Characterization and modeling of polysilicon MEMS chemical-mechanical polishing
Tang, Brian D. (Brian David), 1980- (2004)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing using fixed abrasive technology
Dutt, Radhika, 1978- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Characterization and modeling of pattern dependencies in copper interconnects for integrated circuits
Park, Tae Hong, 1973- (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
The effects of strain on carrier transport in thin and ultra-thin SOI MOSFETs
Lauer, Isaac, 1976- (2005)
- Advisor: Dimitri A. Antoniadis
- Department of Electrical Engineering and Computer Science
- Advisor: Duane Boning
- Department of Electrical Engineering and Computer Science
Through-substrate interconnects for 3-D integration and RF systems
Wu, Joyce H. (Joyce Hsia-Sing), 1974- (2006)
- Advisor: Jesús A. del Alamo
- Department of Electrical Engineering and Computer Science
A statistical metrology framework for characterizing ILD thickness variation in CMP processes
Chang, Eric Choong-Yin (1996)
- Advisor: James Chung
- Department of Electrical Engineering and Computer Science
Using statistical metrology to understand pattern-dependent ILD thickness variation in oxide CMP processes
Divecha, Rajesh Ramji (1997)
- Advisor: Duane Boning
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing for shallow trench isolation
Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science