Theses most similar to those of author Tang, Brian D. (Brian David), 1980-
Characterization and modeling of polysilicon MEMS chemical-mechanical polishing (2004) read it
Analysis of DRIE uniformity for microelectromechanical systems
Hill, Tyrone F. (Tyrone Frank), 1980- (2004)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing using fixed abrasive technology
Dutt, Radhika, 1978- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Characterization and modeling of pattern dependencies in copper interconnects for integrated circuits
Park, Tae Hong, 1973- (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Chip-scale modeling of pattern dependencies in copper chemical mechanical polishing processes
Gbondo-Tugbawa, Tamba Edward (2002)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
- Advisor: Leslie A. Kolodziejski
- Department of Electrical Engineering and Computer Science
Framework for characterization of copper interconnect in damascene CMP processes
Park, Tae Hong, 1973- (1998)
- Advisors: Duane Boning; James Chung
- Department of Electrical Engineering and Computer Science
Characterization and modeling of uniformity in chemical mechanical polishing
Oji, Charles (Charles Ojih), 1974- (1999)
- Advisors: Duane Boning; James Chung
- Department of Electrical Engineering and Computer Science
Modeling of chemical mechanical polishing for shallow trench isolation
Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science