Theses most similar to Using statistical metrology to understand pattern-dependent ILD thickness variation in oxide CMP processes (Divecha, Rajesh Ramji; 1997) read it
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- Department of Electrical Engineering and Computer Science
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Physical understanding and modeling of chemical mechanical planarization in dielectric materials
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Framework for characterization of copper interconnect in damascene CMP processes
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- Advisors: Duane Boning; James Chung
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Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries
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Gan, Terence (Terence Chihkiong), 1975- (2000)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science