Theses most similar to Effects of mechanical properties on the reliability of Cu/low-k metallization systems (Wei, Frank L. (Frank Lili), 1977-; 2007) read it
Design tool and methodologies for interconnect reliability analysis in integrated circuits
Alam, Syed Mohiul, 1975- (2004)
- Advisors: Carl V. Thompson, II; Donald E. Troxel
- Department of Electrical Engineering and Computer Science
New methodologies for interconnect reliability assessments of integrated circuits
Hau-Riege, Stefan P. (Stefan Peter), 1970- (2000)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Engineered substrates for coplanar integration of lattice-mismatched semiconductors with silicon
Pitera, Arthur Joseph, 1975- (2005)
- Advisor: Eugene A. Fitzgerald
- Department of Materials Science and Engineering
- Advisor: James E. Chung
- Department of Electrical Engineering and Computer Science
Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits
Tadepalli, Rajappa, 1979- (2007)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Nagarajan, Raghavan (2008)
- Advisors: Carl V. Thompson, II; Chee Lip Gan
- Department of Materials Science and Engineering
Modeling of advanced integrated circuit planarization processes : electrochemical-mechanical planarization (eCMP), STI CMP using non-conventional slurries
Johnson, Joy Marie (2009)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Effect of nano-scale twinning on the fracture, fatigue and wear properties of copper
Singh, Aparna, Ph.D (2011)
- Advisor: Christopher A. Schuh
- Department of Materials Science and Engineering