Theses most similar to those of author Chiang, Diana C. (Diana Chih-Chan), 1975-
Underfill material selection for flip chip technology (1998) read it
- Advisor:
- Department of Materials Science and Engineering
Injection compression modeling of non-linear positive temperature coefficient circuit protection devices
Hardy, Joseph T., 1978- (2005)
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering
- Advisor: Alexander H. Slocum
- Department of Mechanical Engineering
Radio-frequency properties of melt-recrystallized YBa₂Cu₃O₇â[delta] fibers
Daniels, Michael W. (Michael William) (1994)
- Advisor: Michael J. Cima
- Department of Materials Science and Engineering
Effect of metallization on electrical performance of surface acoustic wave resonators
Chu, Jason W (1996)
- Advisor: Carl V. Thompson, II
- Department of Electrical Engineering and Computer Science
- Advisor: Frederick J. McGarry
- Department of Materials Science and Engineering
Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability
Clough, Sherry L. (Sherry Lynn), 1969- (1998)
- Advisors: David Simchi-Levi Roy Welsc; Frederic McGarry
- Department of Materials Science and Engineering
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering
Investigation of sintered powder electrodes in electrical discharge machining,
Giddens, William E. (William Edgar) (1971)
- Advisor: Prescott A. Smith
- Department of Mechanical Engineering
Post oxide etching cleaning process using integrated ashing and HF vapor process
Kwon, Ohseung, 1969- (1999)
- Advisor: Herbert H. Swain
- Department of Materials Science and Engineering