Theses most similar to those of author Clough, Sherry L. (Sherry Lynn), 1969-
Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability (1998) read it
Development of pick-and-place assembly techniques for monolithic optopill integration
Teo, Mindy Simin, 1981- (2004)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
- Advisor: Deborah Ancona
- Department of Materials Science and Engineering
Design and prototype : a manufacturing system for the soft lithography technique
Cao, Arthur Y. (Arthur Yao) (2006)
- Advisor: David E. Hardt
- Department of Mechanical Engineering
Underfill material selection for flip chip technology
Chiang, Diana C. (Diana Chih-Chan), 1975- (1998)
- Advisor: David K. Roylance
- Department of Materials Science and Engineering
- Advisor: Michael J. Cima
- Department of Materials Science and Engineering
- Advisor: Rajeev R. Ram
- Department of Electrical Engineering and Computer Science
Determining the root causes of excess metal and void defects with respect to the photoresist quality in thin film PZT fabrication processes
Lee, Jun B., M. Eng. (Jun Bum) (2012)
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering
Thermally-actuated piezoresistively-sensed mechanical silicon oscillator
Sundaram, Subramania (2014)
- Advisor: Dana Weinstein
- Department of Electrical Engineering and Computer Science
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering