Theses most similar to those of author Fan, Andy, 1976-

Three dimensional integration technology using copper wafer bonding (2006) read it

  • Advisor: Christopher J. Terman
  • Department of Electrical Engineering and Computer Science
  • Advisors: Anantha P. Chandrakasan; Jing Kong
  • Department of Electrical Engineering and Computer Science
  • Advisor: Clifton G. Fonstad, Jr.
  • Department of Electrical Engineering and Computer Science
  • Advisor: Dimitri A. Antoniadis
  • Department of Electrical Engineering and Computer Science
  • Advisors: Carl V. Thompson, II; Chee Lip Gan
  • Department of Materials Science and Engineering
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  • Department of Electrical Engineering and Computer Science
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  • Department of Electrical Engineering and Computer Science
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  • Department of Electrical Engineering and Computer Science
  • Advisor: Anantha P. Chandrakasan
  • Department of Electrical Engineering and Computer Science
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  • Department of Electrical Engineering and Computer Science

An evaluation of three dimensional integration technology (1999) read it

  • Advisor: Clifton G. Fonstad, Jr.
  • Department of Electrical Engineering and Computer Science
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  • Department of Electrical Engineering and Computer Science
  • Advisor: Henry I. Smith
  • Department of Electrical Engineering and Computer Science
  • Advisor: Leslie A. Kolodziejski
  • Department of Electrical Engineering and Computer Science
  • Advisors: Anantha P. Chandrakasan; L. Rafael Reif
  • Department of Electrical Engineering and Computer Science
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  • Department of Electrical Engineering and Computer Science
  • Advisor: Akintunde Ibitayo (Tayo) Akinwande
  • Department of Electrical Engineering and Computer Science
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  • Department of Physics
  • Advisor: Tomás Palacios
  • Department of Electrical Engineering and Computer Science