Theses most similar to those of author Slade, J. Morgan

Thermomechanical strain analysis of electronic packages using Moiré interferometry by computational and manual fringe reduction (1996) read it

  • Advisor: Carl V. Thompson, II
  • Department of Materials Science and Engineering
  • Advisor: Henry I. Smith
  • Department of Electrical Engineering and Computer Science
  • Advisor: Tomasz Wierzbicki
  • Department of Mechanical Engineering