Theses most similar to those of author Chen, Kuan-Neng, 1974-

Copper wafer bonding in three-dimensional integration (2005) read it

  • Advisor: Clifton G. Fonstad, Jr.
  • Department of Electrical Engineering and Computer Science
  • Advisor: Eugene A. Fitzgerald
  • Department of Materials Science and Engineering
  • Advisors: Anantha P. Chandrakasan; L. Rafael Reif
  • Department of Electrical Engineering and Computer Science
  • Advisor: Leslie A. Kolodziejski
  • Department of Electrical Engineering and Computer Science
  • Advisor: Clifton G. Fonstad, Jr.
  • Department of Electrical Engineering and Computer Science
  • Advisor: Clifton Fonstad
  • Department of Electrical Engineering and Computer Science
  • Advisor: Eugene A. Fitzgerald
  • Department of Materials Science and Engineering
  • Advisor: Clifton G. Fonstad, Jr.
  • Department of Electrical Engineering and Computer Science
  • Advisor: Judy L. Hoyt
  • Department of Electrical Engineering and Computer Science
  • Advisor: Eugene A. Fitzgerald
  • Department of Materials Science and Engineering