Theses most similar to those of author Tadepalli, Rajappa, 1979-

Characterization of bonded copper interconnects for three-dimensional integrated circuits (2002) read it

  • Advisors: Deyst, John J. (John Jacob); Wallace E. VanderVelde
  • Department of Aeronautics and Astronautics
  • Advisor: Duane S. Bonging
  • Department of Electrical Engineering and Computer Science
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  • Technology, Management, and Policy Program
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  • Department of Nuclear Engineering
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  • Department of Civil and Environmental Engineering
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Characterization and requirements for Cu-Cu bonds for three-dimensional integrated circuits (2007) read it

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  • Department of Electrical Engineering and Computer Science
  • Advisor: L. Rafael Reif
  • Department of Electrical Engineering and Computer Science
  • Advisor: Eugene A. Fitzgerald
  • Department of Materials Science and Engineering
  • Advisors: Anantha P. Chandrakasan; L. Rafael Reif
  • Department of Electrical Engineering and Computer Science
  • Advisor: Carl V. Thompson, II
  • Department of Materials Science and Engineering
  • Advisor: Carl V. Thompson, II
  • Department of Materials Science and Engineering
  • Advisors: Carl V. Thompson, II; Chee Lip Gan
  • Department of Materials Science and Engineering
  • Advisor: L. Rafael Reif
  • Department of Electrical Engineering and Computer Science