Theses most similar to Design and measurement analysis of hot embossing system for high aspect ratio microfluidics (Ragosta, Nicholas (Nicholas Hiroshi); 2013) read it
- Advisor: David E. Hardt
- Department of Mechanical Engineering
- Advisor: David E. Hardt
- Department of Mechanical Engineering
- Advisor: David E. Hardt
- Department of Mechanical Engineering
- Advisor: David E. Hardt
- Department of Mechanical Engineering
Manufacturing of lab-on-a-chip devices : characterizing seals for on-board reagent delivery
Inamdar, Tejas Satish (2013)
- Advisor: Brian W. Anthony
- Department of Mechanical Engineering
Hot embossing as a method for rapid prototyping microfluidic devices
Nguyen, Khanh H. (Khanh Huy) (2013)
- Advisor: Brian Anthony
- Department of Mechanical Engineering
Design and process optimization of a hot embossing machine for microfluidics with high aspect ratios
Kalsekar, Viren Sunil (2013)
- Advisor: Brian Anthony
- Department of Mechanical Engineering
Development of adhesive bonding and functional testing systems for in-process inspection of hot embossed microfluidic devices
Reyda, Caitlin J. (Caitlin Jilaine) (2014)
- Advisor: David E. Hardt
- Department of Mechanical Engineering
- Advisor: David E. Hardt
- Department of Mechanical Engineering
Fabrication and qualification of arbitrarily patterned seamless tooling for continuous roll-to-roll microcontact printing
Ascoli, Peter A (2017)
- Advisor: David E. Hardt
- Department of Mechanical Engineering