Theses most similar to Development of a melting and directional solidification process for improving the grain structure and electronic properties of a silicon wafer (Greenlee, Alison S; 2011) read it
Solid state thermal gradient processing of Y₁Ba₂Cu₃O₇âx/Ag superconducting composite ribbons
Kaforey, Monica L (1994)
- Advisor: John B. Vander Sande
- Department of Materials Science and Engineering
- Advisor: Leslie A. Kolodziejski
- Department of Electrical Engineering and Computer Science
The mechanism of thin film Si nanomachining using femtosecond laser pulses
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- Advisor: Carl V. Thompson, II
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3-dimensional modeling and simulation of surface and sidewall roughening during plasma etching
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- Advisor: Herbert H. Sawin
- Department of Chemical Engineering
A feature-to-wafer-scale model of etch-rate non-uniformity in deep reactive ion etching/
Diaz, Jaime O. (Jaime Oscar Diaz Villamil) (2010)
- Advisor: Donald S. Boning Duane S. Boning
- Department of Electrical Engineering and Computer Science
Nucleation and solidification of silicon for photovoltaics
Appapillai, Anjuli T. (Anjuli Tara) (2010)
- Advisor: Emanuel M. Sachs
- Department of Mechanical Engineering
Platform for monolithic integration of III-V devices with Si CMOS technology
Pacella, Nan Yang (2012)
- Advisor: Eugene A. Fitzgerald
- Department of Materials Science and Engineering
Electrical impact assessment of dislocations in silicon materials for solar cells
Castellanos Rodriguez, Sergio (2015)
- Advisor: Tonio Buonassisi
- Department of Mechanical Engineering
Towards the development of a horizontal ribbon growth process to produce thin, monocrystalline silicon sheets via the stabilization of the (111) plane in undercooled melts
Greenlee, Alison S (2015)
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering
The effects of deposit thermal history on microstructure produced by uniform droplet spray forming
Cherng, Jean-Pei Jeanie (2002)
- Advisor: Dr. Jung-Hoon Chun
- Department of Mechanical Engineering