Theses most similar to Packaging and interconnection of a black-lit CCD sensor device (Bennett, Joshua V. (Joshua Victor); 1997) read it
- Advisor: S. Mark Spearing
- Department of Aeronautics and Astronautics
MEMS structures for stress measurements for thin films deposited using CVD
Lau, Yu-Hin F. (Yu-Hin Felix) (2001)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Methods for increasing the thermal conductivity of ultra-high molecular weight polyethylene (UHMWPE)
Miler, Josef L (2006)
- Advisor: Gang Chen
- Department of Mechanical Engineering
- Advisor: Rosemary L. Smith
- Department of Mechanical Engineering
Experimental determination of processing-induced stresses and properties of graded nickel-alumina coatings
Kesler, Olivera E. (Olivera Elizabeth) (1997)
- Advisor: Subra Suresh
- Department of Materials Science and Engineering
Microplastic deformation of polycrystalline silver chloride containing a small volume fraction of hard inclusions
Calhoun, Robert Bensen (1998)
- Advisor: Andreas Mortensen
- Department of Materials Science and Engineering
Development of a selective substrate metallization process via electorless gel plating
Arndt, Kenneth C (1996)
- Advisor: Michael J. Cima
- Department of Materials Science and Engineering
Optoelectonic integration using aligned metal-to-semiconductor bonding
Giziewicz, Wojciech Piotr, 1977- (2000)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
Characterizing the material properties of polymer-based microelectrode arrays for retinal prosthesis
Park, Christina Soyeun, 1980- (2003)
- Advisor: Rohan Abeyaratne
- Department of Mechanical Engineering
Cu-based shape memory microwires : towards complex structures
Gager, Mac (Brian McClure, Jr.) (2014)
- Advisor: Christopher A. Schuh
- Department of Materials Science and Engineering