Theses most similar to 3-dimensional modeling and simulation of surface and sidewall roughening during plasma etching (Kawai, Hiroyo; 2008) read it
Anisotropic dewetting in ultra-thin single-crystal silicon-on-insulator films
Danielson, David T. (David Thomas) (2008)
- Advisor: Lionel C. Kimerling
- Department of Materials Science and Engineering
Feature profile evolution during the high density plasma etching of polysilicon
Mahorowala, Arpan P. (Arpan Pravin), 1970- (1998)
- Advisor: Herbert H. Swain
- Department of Chemical Engineering
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Development of a melting and directional solidification process for improving the grain structure and electronic properties of a silicon wafer
Greenlee, Alison S (2011)
- Advisor: Emanuel M. Sachs
- Department of Mechanical Engineering
Quantitative analysis of anisotropic edge retraction during solid-state dewetting of thin single crystal films
Kim, Gye Hyun (2012)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Synthesis of III-V nitride nanowires with controlled structure, morphology, and composition
Crawford, Samuel Curtis (2014)
- Advisor: Silvija Gradečak
- Department of Materials Science and Engineering
Study of phenomenologies during templated solid-state dewetting of thin single crystal films
Kim, Gye Hyun (2016)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Fabrication of capacitors based on silicon nanowire arrays generated by metal-assisted wet chemical etching
Zheng, We (2016)
- Advisor: Carl V. Thompson, II
- Department of Materials Science and Engineering
Origin, evolution, and control of sidewall line edge roughness transfer during plasma etching
Rasgon, Stacy A., 1974- (2005)
- Advisor: Herbert H. Swain
- Department of Chemical Engineering