Theses most similar to Through-substrate interconnects for 3-D integration and RF systems (Wu, Joyce H. (Joyce Hsia-Sing), 1974-; 2006) read it
A high aspect-ratio silicon substrate-via technology and applications
Wu, Joyce H. (Joyce Hsia-Sing), 1974- (2000)
- Advisor: Jesús A. del Alamo
- Department of Electrical Engineering and Computer Science
Post assembly process development for Monolithic OptoPill integration on silicon CMOS
Lei, Yi-Shu Vivian, 1979- (2004)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
Magnetically assisted statistical assembly of III-V heterostructures on silicon : initial process and technology development
Perkins, James Michael, 1978- (2002)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
Design and fabrication of a vertical power MOSFET with an integral turn-off driver
Bernstein, Joseph Barry (1986)
- Advisor: Martin F. Schlecht
- Department of Electrical Engineering and Computer Science
Low threshold vertical cavity surface emitting lasers integrated onto Si-CMOS ICs using novel hybrid assembly techniques
Perkins, James Michael, 1978- (2007)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
- Advisor: Jesús A. del Alamo
- Department of Electrical Engineering and Computer Science
- Advisor: Dimitri A. Antoniadis
- Department of Electrical Engineering and Computer Science
- Advisor: Tomás Palacios
- Department of Electrical Engineering and Computer Science
A miniaturized single crystal silicon solar cell array for a MEMS power source
Gerrish, Nicole D. (Nicole Danielle), 1976- (1999)
- Advisors: Eugene A. Fitzgerald; Jeffrey T. Borenstein
- Department of Materials Science and Engineering
Evaporation from nanoporous membranes for high heat flux thermal management
Hanks, Daniel Frank (2016)
- Advisor: Evelyn N. Wang
- Department of Mechanical Engineering