Theses most similar to Low temperature transient liquid phase bonding of copper (Williams, Joel C. (Joel Carlton); 2005) read it
- Advisor: Ballinger, Ronald George
- Department of Nuclear Engineering
- Advisor: R.M. Pelloux
- Department of Materials Science and Engineering
Compositional influences on the microstructures, phase stability, and mechanical properties of TiCr₂ laves phase alloys
Chen, Katherine C. (Katherine Cheeyung) (1996)
- Advisor: Samuel M. Allen
- Department of Materials Science and Engineering
Process development and characterization of an oxide dispersion stabilized nickel base superalloy
Smith, Charles Hubert (1982)
- Advisor: Nicholas J. Grant
- Department of Materials Science and Engineering
- Advisor: Thomas W. Eagar
- Department of Materials Science and Engineering
Novel approaches to low temperature transient liquid phase bonding in the In-Sn/Cu and In-Sn-Bi/Cu systems
Fischer, David S. (2008)
- Advisors: Thomas W. Eagar; Vien Nguyen
- Department of Materials Science and Engineering
- Advisor: W.F. Brace
- Department of Earth, Atmospheric, and Planetary Sciences
- Advisors: Thomas W. Eagar; Vien Nguyen
- Department of Materials Science and Engineering
Investigation of the remolding step in reference free part encapsulation
Valdivia y Alvarado, Paula J. (Paula Jenny), 1976- (2000)
- Advisor: Sanjay E. Sarma
- Department of Mechanical Engineering
The effect of annealing on the microstructure of Cu-Al-Ni-Mn shape memory alloy microwires
Shukla, Keerti (2015)
- Advisor: Christopher A. Schuh
- Department of Materials Science and Engineering