Theses most similar to Copper wafer bonding in three-dimensional integration (Chen, Kuan-Neng, 1974-; 2005) read it
Wafer bonding of processed Si CMOS VLSI and GaAs for mixed technology integration
Barkley, Edward Robert, 1977- (2001)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
Advanced engineered substrates for the integration of lattice-mismatched materials with silicon
Isaacson, David Michael, 1976- (2006)
- Advisor: Eugene A. Fitzgerald
- Department of Materials Science and Engineering
- Advisors: Anantha P. Chandrakasan; L. Rafael Reif
- Department of Electrical Engineering and Computer Science
The effect of nucleation on the quality of MBE-ZnSe/III-V heterostructures
Warlick, Emily L. (Emily Linda) (1996)
- Advisor: Leslie A. Kolodziejski
- Department of Electrical Engineering and Computer Science
Wafer bonding for monolithic integration of Si CMOS VLSI electronics with III-V optoelectronic devices
London, Joanna M., 1974- (1998)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
- Advisor: Clifton Fonstad
- Department of Electrical Engineering and Computer Science
Platform for monolithic integration of III-V devices with Si CMOS technology
Pacella, Nan Yang (2012)
- Advisor: Eugene A. Fitzgerald
- Department of Materials Science and Engineering
Optoelectonic integration using aligned metal-to-semiconductor bonding
Giziewicz, Wojciech Piotr, 1977- (2000)
- Advisor: Clifton G. Fonstad, Jr.
- Department of Electrical Engineering and Computer Science
- Advisor: Judy L. Hoyt
- Department of Electrical Engineering and Computer Science
Integration of GaAsP alloys on SiGe virtual substrates for Si-based dual-junction solar cells
Sharma, Prithu (2013)
- Advisor: Eugene A. Fitzgerald
- Department of Materials Science and Engineering